Power cycling simulation of an IC package: Considering electromigration and thermal-mechanical failure

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 415-421

  Liu, Yong ^a   Irving, Scott ^a  

^a FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACKS; ELECTROMIGRATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE;

INTEGRATED CIRCUIT PACKAGE; POWER CYCLING SIMULATION; SOLDER JOINT FATIGUE FAILURE; THERMAL MECHANICAL FAILURE;

ELECTRONICS PACKAGING;

EID: 0038689315     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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