Fabrication of a switch module by embedding chip capacitors and an active IC in organic substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1980-1985

  Ryu, Jong In ^a   Moon, Jong Won ^a   Park, Se Hoon ^a   Kim, Dongsu ^a   Kim, Jun Chul ^a   Park, Jong Chul ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGILENT; AJINOMOTO; CHIP CAPACITOR; DC BLOCK; DC VOLTAGE; DECOUPLING CAPACITOR; DIELECTRIC CONSTANTS; EMBEDDED CAPACITOR; FREQUENCY RANGES; INPUT PORT; MODELLING AND SIMULATIONS; ORGANIC SUBSTRATE; OUTPUT PORTS; PAD SIZES; PROBE STATIONS; SINGLE POLE DOUBLE THROW; SWITCH MODULES; TRANSMISSION LINE;

BANDPASS FILTERS; CAPACITANCE; DC POWER TRANSMISSION; DIES; ELECTRIC NETWORK ANALYSIS; FUZZY CONTROL; SUBSTRATES;

CAPACITORS;

EID: 77955221761     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490676     Document Type: Conference Paper

References (13)

1. J. Wolf, F.J. Schmückle, et al. "System integration for high frequency applications.", In Proceedings ISHM 97, Philadelphia, October 1997.
2. M. Töpper and J. Wolf. "MCM-D with embedded active and passive components." In Proceedings ISHMC 96, Minneapolis, October 1996.
3. th Int. Sym. on Quality Electronic Design, pp.589-593, 2008.
4. th Int. Conf. on Electronics Packaging Technology, 2006.
5. J. I. Ryu, D. Kim, H. M. Cho, and J. C . Kim, "Implementation of WLAN front end module with a power amplifier," in Proc of the Asia Pacific Microwave Conf., pp. 99-102, vol.1,2007.
6. Dongsu Kim, D.H Kim, J.I. Ryu, and J.C Kim, "Highly integrated triplexers for WiMAX applications," 2008 MTT-S, pp. 614-617, 2008.
7. D. H. Kim, D. Kim, J. I. Ryu, J. C. Kim, C. D. Park, I. S. Song, "Implementation of an LTCC Quad-band module for WLAN and WiMAX applications," Proc Eur. Microwave. Conf., PP.614-617, 2008.
8. J. I. Ryu, D. Kim, and J. C . Kim, "Isolation Effect Between DC supply Voltage Signal Lines in Wireless LAN Module," in Proceeding of the 20th Inter. Zurich Sym., pp. 385-388, 2009.
9. J. I. Ryu, D. Kim, S.H Park, J.C Park and J. C . Kim, "Investgation of an Embedded RF Switch IC in Printed Circuit Board," in Proceeding of the Electrical Design of Advanced Packaging and Systems Sym., pp. 81-84, 2008.
10. D. Meizhu, L. Shufang, and Q. Xiaofeng, "Via Design in Multi-layer PCB," in Proc of the Asia Pacific on Environmental Electromagnetics conf., pp. 94-98, 2003.
11. A. Ostmann, A. Neumann, J. Auersperg, C. Ghahremani, "Intergration of Passive and Active Components into Build-Up Layers." In Proc. of the Electronics Packaging Technology Conf., pp. 223-228, 2002.
12. S. Wu, E. Jahja, W. Yen, and J. Wang, "Study of Discrete Capacitor Embedded Process and Characterization Analysis in Organic-Base Substrate," in Proc. Of Electronics Packaging Technology Conference, PP. 125-129, 2007.
13. J. Ryu, S. Park, J. Moon, D. Kim, J. Kim, and N. Kang, "Implementation of a Front-End-Module by Embedding a RF Switch IC and a Power Amplifier in Printed-Circuitboard," in Proc. Of Electronic Components and Technology Conf., PP.1920-1925, 2009