Investigation of an embedded RF switch IC in printed-circuit-board

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Volumn , Issue , 2008, Pages 81-84

  Ryu, Jong In ^a   Kim, Dongsu ^a   Park, Se Hoon ^a   Park, Jong Chul ^a   Kim, Jun Chul ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

RETURN LOSS; RF PERFORMANCE; RF SWITCHES; VIA INTERCONNECTIONS; WIRE BONDINGS;

CHIP SCALE PACKAGES; PACKAGING; SUBSTRATES; WIRE;

PRINTED CIRCUIT BOARDS;

EID: 60649092571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDAPS.2008.4736004     Document Type: Conference Paper

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