Via design in multi-layer PCB

Proceedings - Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2003

Volumn , Issue , 2003, Pages 94-98

  Du, Meizhu ^a   Li, Shufang ^a   Qiu, Xiaofeng ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

RADIATION;

GEOMETRY PROPERTIES; HIGH FREQUENCY HF; MULTI-LAYER PCBS; OPTIMIZATION CRITERIA; REFLECTION LOSS; ROUTING LAYERS; SIGNAL FREQUENCIES; SIGNAL REFLECTION;

POLYCHLORINATED BIPHENYLS;

EID: 50049110193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEEM.2003.238594     Document Type: Conference Paper

References (4)

1. Jiunn-Nan Hwang and Tzong-Lin Wu. Coupling of the Ground Bounce Noise to the Signal Trace with Via Transition in Partitioned Power Bus of PCB. 0-7803-7264-6/02, 2002 IEEE:733-736
2. Li Shufang, Yin Chenguang, Sun Ying. Analysis of Via Effects on High Speed Signal Transmission. ICT2002:482-485
3. Hong-Guan Low, Mahadevan K.Iyer, et al. Via Design Optimization for High Speed Device Packaging. IEEE/CPMT Electronics Packaging Technology Coonference, 1998:112-118
4. S. Maeda, T. Kashiwa, and I. Fukai. Full-wave analysis and propagation characterisctics of a throuth hole using the finite difference time-domain method. IEEE Trans. Microwave Theory Tech., Vol. MTT-39, No. 12, 1991:2154-2159