Study of discrete capacitor embedded process and characterization analysis in organic-base substrate

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 125-129

  Wu, Sung Mao ^a   Jahja, Endruw ^a   Yen, Wen Kuan ^a   Wang, Jui Wen ^b  

^a NATIONAL UNIVERSITY OF KAOHSIUNG   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Blind via; Embedded substrate; Passive embedded process flow; Simultaneous switching noise (SSN)

Indexed keywords

BASE SUBSTRATE; BLIND VIA; DECOUPLING CAPACITORS; ELECTROMAGNETIC SIMULATIONS; EMBEDDED SUBSTRATE; HIGH FREQUENCIES; INTEGRATED PROCESSING; MULTI LAYERING; ORGANIC SUBSTRATES; PACKAGING TECHNOLOGIES; PASSIVE COMPONENTS; PASSIVE EMBEDDED PROCESS FLOW; RELIABILITY TESTING; SIMULTANEOUS SWITCHING NOISE (SSN);

CAPACITANCE; CAPACITORS; CHIP SCALE PACKAGES; DIELECTRIC DEVICES; ELECTRIC CURRENTS; ELECTRIC EQUIPMENT; ELECTROMAGNETISM; ELECTRONICS PACKAGING; ENERGY STORAGE; STANDARDIZATION; STANDARDS; TECHNOLOGY;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049131107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469689     Document Type: Conference Paper

References (8)

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7. Morcan, G.; Lenihan, T.; Parkerson, J.P.; Schaper, L.; Ang, S, "Electrical Characterization of Multilayered Thin Film Integral Passive Devices", Electronic Components and Technology Conference, 1998, pp.240-246
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