Implementation of a front-end-module by embedding a RF switch IC and a power amplifier in printed-circuit-board

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1920-1925

  Ryu, Jong In ^a   Park, Se Hoon ^a   Moon, Jong Won ^a   Kim, Dongsu ^a   Kim, Jun Chul ^a   Kang, Namkee ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSION; AJINOMOTO; BUILD-UP PROCESS; CAVITY FILLING; CHANNEL POWER RATIOS; COPPER LAYER; INPUT IMPEDANCE; LAMINATION PROCESS; LOW-PASS; OUTPUT SPECTRUM; PLANAR SURFACE; POWER AMPLIFIER MODULE; RETURN LOSS; RF SWITCH; SIDE LOBES; SIMULATION TOOL; VOID-FREE;

ASSOCIATIVE STORAGE; ELECTRIC IMPEDANCE; LOCAL AREA NETWORKS; PNEUMATIC DRIVES; POWER AMPLIFIERS; PULSE AMPLITUDE MODULATION; WIRELESS LOCAL AREA NETWORKS (WLAN);

PRINTED CIRCUIT BOARDS;

EID: 70349663659     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074282     Document Type: Conference Paper

References (8)

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