A package demonstration with solder free compliant flexible interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1429-1435

  Shubin, I ^a   Chow, A ^a   Cunningham, J ^a   Giere, M ^a   Nettleton, N ^a   Pinckney, N ^a   Shi, J ^a   Simons, J ^a   Hopkins, R ^a   Mitchell, J ^a   Douglas, D ^a   Chow, E M ^b   DeBruyker, D ^b   Cheng, B ^b   Anderson, G ^b  

^a ORACLE CORPORATION   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY APPROACH; FINE PITCH; FLEXIBLE INTERCONNECTS; HIGH-CURRENT; HIGHLY INTEGRATED; MICRO-SPRINGS; MICROSPRING; ROOM TEMPERATURE; SOLDER BUMP INTERCONNECTS; TEMPERATURE CYCLING;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SOLDERING; SPRINGS (COMPONENTS); TECHNOLOGY;

CMOS INTEGRATED CIRCUITS;

EID: 77955219670     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490813     Document Type: Conference Paper

References (13)

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