Measuring 6D chip alignment in multi-chip packages

Proceedings of IEEE Sensors

Volumn , Issue , 2007, Pages 1307-1310

  Chow, Alex ^a   Hopkins, David ^a   Ho, Ron ^a   Drost, Robert ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; CAPACITANCE; CAPACITANCE MEASUREMENT;

CAPACITIVE SENSING; CHIP ALIGNMENT; CMOS CHIPS; MEASURING COUPLING; MULTI-CHIP PACKAGES; PARASITIC CAPACITANCES;

SENSORS;

EID: 48349087641     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2007.4388650     Document Type: Conference Paper

References (12)

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