Experimental investigation of vapor chamber module applied to high-power light-emitting diodes

Experimental Heat Transfer

Volumn 22, Issue 1, 2009, Pages 26-38

  Huang, H S ^a   Chiang, Y C ^b   Huang, C K ^a   Chen, S L ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b CHINESE CULTURE UNIVERSITY   (Taiwan)

Author keywords

Flat plate type vapor chamber; Lamp type vapor chamber; Natural convection; Spreading resistance

Indexed keywords

ALUMINA; ALUMINUM; CURRENT DENSITY; DIODES; ELECTRIC FIELD EFFECTS; LIGHT EMISSION; LIGHT EMITTING DIODES; NATURAL CONVECTION;

ALUMINUM PLATES; COPPER PLATES; EXPERIMENTAL INVESTIGATIONS; FLAT-PLATE-TYPE VAPOR CHAMBER; HEAT DISSIPATIONS; HIGH-POWER LIGHT-EMITTING DIODES; HOT SPOTS; LAMP-TYPE VAPOR CHAMBER; SPREADING RESISTANCE; TEMPERATURE DIFFERENCES; THERMAL MANAGEMENTS; THERMAL PERFORMANCE; THERMAL RESISTANCES; WALL TEMPERATURES;

VAPORS;

EID: 60749116639     PISSN: 08916152     EISSN: 15210480     Source Type: Journal    
DOI: 10.1080/08916150802530187     Document Type: Article

References (18)

1. M. G. Craford, LEDs for Solid State Lighting and Other Emerging Applications: Status, Trends, and Challenges, Fifth Int. Conf. Solid State Lighting, vol. 5941, pp. 1-10, 2005.
2. M. Arik, J. Petroski, and S. Weaver, Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes, Proceedings of Intersociety Conference on Thermal Phenomena, San Diego, CA, pp. 113-120, May 30-June 1, 2002.
3. S. Lee, S. Song, V. Au, and K. P. Moran, Constriction/Spreading Resistance Model for Electronics Packaging, Proc. ASME-JSME Thermal Eng. Joint Conf., vol. 4, pp. 199-206, 1995.
4. M. Arik, C. Becker, S. Weaver, and J. Petroski, Thermal Management of LEDs: Package to System, Third Int. Conf Solid State Lighting, vol. 5187, pp. 64-75, 2004.
5. T. Acikalin, S. V. Garimella, J. Petroski, and A. Raman, Optimal Design of Miniature Piezoelectric Fans for Cooling Light Emitting Diodes, Proc. Intersoc. Conf. Thermal Phenomena, vol. 1, pp. 663-671, 2004.
6. S. Liu, T. Lin, X. Luo, M. Chen, and X. Jiang, A Microjet Array Cooling System for Thermal Management of Active Radars and High-Brightness LEDs, 56th Electronic Components and Technology Conference, San Diego, CA, pp. 1634-1638, May 30-June 2, 2006.
7. J. Metz and S. Robert, Heat-Dissipating Method and Device for LED Display, U.S. Patent 5173839, 1992.
8. P. A. Hochstein, LED Lamp Assembly with Means to Conduct Heat Away from the LEDs, U.S. Patent 6045240, 2000.
9. G. J. Sheu, F S. Hwu, S. H. Tu, W. T. Chen, J. Y. Chang, and J. C. Chen, The Heat Dissipation Performance of LED Applied a MHP, Fifth Int. Conf. Solid State Lighting, vol. 5941, pp. 1-8, 2005.
10. M. W. Shin, Thermal Design of High-Power LED Package and System, Adv. LEDs Solid State Lighting, vol. 6355, pp. 1-13, 2006.
11. L. Kim, J. H. Choi, S. H. Jang, and M. W. Shin, Thermal Analysis of LED Array System with Heat Pipe, Thermochimica Acta, vol. 455, pp. 21-25, 2007.
12. J. S. Go, Quantitative Thermal Performance Evaluation of a Cost-Effective Vapor Chamber Heat Sink Containing a Metal-Etched Microwick Structure for Advanced Microprocessor Cooling, Sensors Actuators, vol. 121, pp. 549-556, 2005.
13. J. Wei, A. Chan, and D. Copeland, Measurement of Vapor Chamber Performance, 19th IEEE SEMI-THERM Symposium, San Jose, CA, pp. 191-194, March 11-13, 2003.
14. S. H. K. Lee, S. K. Chu, C. C. C. Choi, and Y. Jaluria, Performance Characteristics of Vapor Chambers with Boiling Enhanced Multi-Wick Structures, 23rd IEEE SEMI-THERM Symposium, San Jose, CA, pp. 125-130, March 18-22, 2007.
15. M. Mochizuki, Y. Saito, F. Kiyooka, T. Nguyen, T. Nguyen, and V. Wuttijumnong, Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors, Proc. ASME InterPack Conf., vol. 1, pp. 695-702, 2007.
16. Y. Xuan, Y. Hong, and Q. Li, Investigation on Transient Behaviors of Flat Type Heat Pipes, Exp. Thermal Fluid Sci., vol. 28, pp. 249-255, 2004.
17. W. M. Rohsenow, J. P. Hartnett, and Y I. Cho, Handbook of Heat Transfer, 3rd ed., McGraw Hill, New York, 1998.
18. ISO, Guide to Expression of Uncertainty in Measurement, International Organization for Standardization, Geneva, Switzerland, 1995.