Reliability estimation for large-area solder joints using explicit modeling of damage

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 2, 2008, Pages 375-386

  Ladani, Leila J ^a  

^a Utah State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL-GRID ARRAYS; CHIP-SCALE PACKAGES; CRACK INITIATION AND PROPAGATION; CREEP DAMAGES; CYCLIC FATIGUES; DAMAGE MODELS; ENERGY PARTITIONING; EXPERIMENTAL DATUM; EXPLICIT MODELING; FINITE-ELEMENT ANALYSIS; LIFE PREDICTIONS; MODELING APPROACHES; POWER DEVICES; RELIABILITY ESTIMATIONS; SCALE DEPENDENCIES; SENSITIVITY STUDIES; SOLDER JOINTS;

BRAZING; CRACKS; CREEP; ELECTRIC EQUIPMENT; WELDING;

SOLDERING ALLOYS;

EID: 64249112535     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.919594     Document Type: Article

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