Finite element analysis to develop a new accelerating test method for board level solder joints for high temperature electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 221-228

  Neher, Wolfgang ^a   Kempe, Wolfgang ^a   Wondrak, Wolfgang ^a   Sauer, Wilfried ^b  

^a DAIMLER AG   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; HIGH TEMPERATURE TESTING; SOLDERED JOINTS; STRAIN; THERMAL CYCLING; THERMAL LOAD; THERMAL STRESS;

BENDING LOADS; BOARD LEVEL SOLDER JOINTS; FATIGUE FAILURES; HIGH TEMPERATURE ELECTRONICS;

AUTOMOBILE ELECTRONIC EQUIPMENT;

EID: 0038012873     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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