Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1132-1138

  Li, Zhaozhi ^c   Lee, Sangil ^d   Lewis, Brian J ^a   Houston, Paul N ^a   Baldwin, Daniel F ^d   Stout, Gene ^b   Tessier, Ted ^b   Evans, John L ^c  

^a ENGENT Inc   (United States)

^b FlipChip International LLC   (United States)

^c AUBURN UNIVERSITY   (United States)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY PROCESS; ASSEMBLY YIELDS; CONFIDENCE LEVELS; EXPERIMENTAL STUDIES; FINE PITCH; FINE-PITCH FLIP CHIP; FLIP CHIP; FLIP CHIP SOLDER JOINTS; INTERMETALLIC COMPOUND THICKNESS; INTERMETALLIC COMPOUNDS; LIQUIDUS; LOW COSTS; NITROGEN ENVIRONMENT; PACKAGE RELIABILITY; PB FREE SOLDERS; PB-FREE; PEAK TEMPERATURES; PROFILE PARAMETERS; QUADRATIC EFFECT; REFLOW CONDITIONS; REFLOW PROCESS; RELIABILITY PERFORMANCE; RESPONSE SURFACE METHODOLOGY; SIGNIFICANT FACTORS; SILICON PACKAGES; SMALL FORM FACTORS; SOAK TIME; SOLDER JOINTS; STATISTICAL DIFFERENCES; YIELD LOSS;

APPROXIMATION THEORY; DESIGN OF EXPERIMENTS; ELECTRONICS PACKAGING; LEAD; LEAD COMPOUNDS; LIQUIDS; PACKAGING; RELIABILITY ANALYSIS; SEMICONDUCTING INTERMETALLICS; SENSITIVITY ANALYSIS; SHEAR STRENGTH; SHOCK TESTING; SILICON COMPOUNDS; SURFACE MOUNT TECHNOLOGY;

SOLDERING ALLOYS;

EID: 77955177753     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490844     Document Type: Conference Paper

References (14)

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