On-chip optical interconnection by using integrated III-V laser diode and photodetector with silicon waveguide

Optics Express

Volumn 18, Issue 15, 2010, Pages 15440-15447

  Ohira, Kazuya ^a   Kobayashi, Kentaro ^a   Iizuka, Norio ^a   Yoshida, Haruhiko ^a   Ezaki, Mizunori ^a   Uemura, Hiroshi ^a   Kojima, Akihiro ^a   Nakamura, Kenro ^a   Furuyama, Hideto ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; LIGHT TRANSMISSION; OPTICAL COMMUNICATION; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; PHOTODETECTORS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DIODES; SEMICONDUCTOR LASERS; WAVEGUIDES;

CHARACTERISTIC TEMPERATURE; FLIP-CHIP BONDING; HEAT DISSIPATION; INGAAS/INP; LASER DIODES; METAL-SEMICONDUCTOR-METAL STRUCTURES; ON CHIPS; ON-CHIP INTEGRATION; OPTICAL INTERCONNECTIONS; OPTICAL TRANSMISSION LINK; SILICON NANOWIRES; SILICON SUBSTRATES; SILICON WAVEGUIDE; SPOT SIZE CONVERTERS; WAVEGUIDE COUPLING;

SILICON WAFERS;

EID: 77954902393     PISSN: None     EISSN: 10944087     Source Type: Journal    
DOI: 10.1364/OE.18.015440     Document Type: Article

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