The electroless plating of Cu-Ni-P alloy onto cotton fabrics

Korean Journal of Chemical Engineering

Volumn 27, Issue 4, 2010, Pages 1145-1149

  Afzali, Arezoo ^a   Mottaghitalab, Vahid ^a   Motlagh, Mahmood Saberi ^b   Haghi, Akbar Khodaparast ^a  

^a UNIVERSITY OF GUILAN   (Iran)

^b Guilan Science and Technology Park   (Iran)

Author keywords

Cotton Fabric; Electroless Plating of Cu Ni P Alloy; Surface Morphology

Indexed keywords

EID: 77954423156     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11814-010-0221-8     Document Type: Article

References (14)

1. R. H. Guo, S. Q. Jiang, C. W. M. Yuen and M. C. F. Ng, J. Mater. Sci.: Mater Electron, DOI 10. 1007/s10854-008-9594-4 (2008).
2. Y. M. Lin and S. H. Yen, Appl. Surf. Sci., 178(1-4), 116 (2001).
3. G. Xueping, W. Yating, L. Lei, Sh. Bin and H. Wenbin, J. Alloys Compounds, 455, 308 (2008).
4. J. Li, H. Hayden and P. A. Kohl, Electrochim. Acta, 49, 1789 (2004).
5. H. Larhzil, M. Cisse, R. Touir, M. Ebn Touhami and M. Cherkaoui, Electrochim. Acta, 53, 622 (2007).
6. J. G. Gaudiello and G. L. Ballard, IBM J. RES. DEVELOP, 37(2) (1993).
7. G. Xueping, W. Yating, L. Lei, Sh. Bin and H. Wenbin, Surface & Coatings Technology, 201, 7018 (2007).
8. E. G. Han, E. A. Kim and K. W. Oh, Synth. Met., 123, 469 (2001).
9. S. Q. Jiang and R. H. Guo, Fibers and Polymers, 9(6), 755 (2008).
10. S. S. Djokic, Fundamental Aspects of Electrometallurgy: Chapter 10, Metal Deposition without an External Current, Eds., K. I. Popov, S. S. Djokic B. N. Grgur, pp. 249-270, Kluwer Academic Publishers, New York (2002).
11. O. Mallory and B. J. Hajdu, Eds., Electroless Plating: Fundamentals and Applications, Noyes Publication, New York (1990).
12. R. C. Agarwala and V. Agarwala, Sadhana, 28, 475 (2003).
13. M. Paunovic, Plating, 51, 1161 (1968).
14. H. F. Chang and W. H. Lin, Korean J. Chem. Eng., 15(5), 559 (1998).