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Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 1, 2009, Pages 33-38

An alternative process for electroless copper plating on polyester fabric

(4) Guo, R H a Jiang, S Q a Yuen, C W M a Ng, M C F a

a HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE PROCESSES; CONTINUOUS PLATINGS; ELECTROLESS; ELECTROLESS COPPER PLATINGS; ELECTROMAGNETIC INTERFERENCES; EMI SHIELDING; OVERALL COSTS; PLATING CONDITIONS; PLATING PROCESSES; POLYESTER FABRICS; SCANNING ELECTRON MICROSCOPES; SHIELDING EFFECTIVENESSES;

COPPER; COPPER PLATING; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROPLATING; FABRICS; PHOTOELECTRON SPECTROSCOPY; PLATING; RADIATION PROTECTION; RADIATION SHIELDING; SCANNING ELECTRON MICROSCOPY; SHIELDING; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTROMAGNETIC SHIELDING;

EID: 58149111255 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-008-9594-4 Document Type: Article

Times cited : (93)

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