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Volumn 37, Issue 2, 1993, Pages 107-115
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Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
AGENTS;
ATOMIC SPECTROSCOPY;
COMPOSITION;
ELECTROCHEMISTRY;
ELECTROLESS PLATING;
EMISSION SPECTROSCOPY;
PHOSPHORUS COMPOUNDS;
PHOTOELECTRON SPECTROSCOPY;
REDUCTION;
X RAY SPECTROSCOPY;
HYPOPHOSPHITE REDUCING AGENT;
METAL MEDIATED ELECTROLESS COPPER PLATING;
COPPER PLATING;
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EID: 0027557181
PISSN: 00188646
EISSN: None
Source Type: Journal
DOI: 10.1147/rd.372.0107 Document Type: Article |
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Times cited : (31)
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References (21)
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