Electrochemical and SEM investigations of the influence of gluconate on the electroless deposition of Ni-Cu-P alloys

Electrochimica Acta

Volumn 53, Issue 2, 2007, Pages 622-628

  Larhzil, H ^a   Cisse M ^a   Touir, R ^a   Touhami, M Ebn ^a   Cherkaoui, M ^a  

^a IBN TOFAIL UNIVERSITY   (Morocco)

Author keywords

Autocatalytic deposition; Ni Cu P; Sodium gluconate

Indexed keywords

CYCLIC VOLTAMMETRY; ELECTROLESS PLATING; RATE CONSTANTS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY;

AUTOCATALYTIC DEPOSITION; CATHODIC REACTIONS; SODIUM GLUCONATE;

COPPER ALLOYS;

EID: 35148873601     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.07.023     Document Type: Article

References (41)

1. Randin T.P., and Hintermann H.E. Plating 54 (1967) 523
2. ASM Metals Handbook, 9th ed., ASM International, Materials Park, OH, vol. 5, 1982, p. 219.
3. Sadeghiv M., Longfield P.D., and Beer C.F. Trans. IMF 61 (1983) 141
4. Gorbunova K.M., Ivanov M.V., and Moiseev V.P. J. Electrochem. Soc. 120 (1973) 613
5. Ma U., and Gawne D.T. Trans. IMF 63 (1985) 64
6. Tulsi S.S. Trans. IMF 64 (1986) 73
7. Park S.H., and Lee D.N. J. Mater. Sci. 23 (1988) 1643
8. Mallory G.O., and Hajdu J.B. Electroless plating: Fundamentals and Applications (1990), AESF, Orlando, FL
9. Tracy R.P., and Shawhan G.J. J. Mater. Perf. 29 (1990) 65
10. Kanani N. Trans. IMF 70 (1992) 14
11. Mandich N.V., and Krulik G.A. Met. Finish. 90 (1992) 25
12. Haidu J.B. Plating Surf. Finish. 83 (1996)
13. Chen C.J., and Lin K.L. Proceedings of the 2000 Electronic Components and Technology Conference (2000) 874
14. Chen C.J., and Lin K.L. J. Electrochem. Soc. 146 (1999) 137
15. Matsui F., and Saito M. Denki Kagaku 38 9 (1987) 96
16. Cherkaoui M., and Chassaing E. Interfinish. 92 (1992) 127
17. Chassing E., Cherkaoui M., and Srhiri A. J. Appl. Electrochem. 23 (1993) 1169
18. Armyanov S., et al. Electrochem. Solid State Lett. 2 7 (1999) 323
19. Gutzeit G. Plating 46 (1959) 1158
20. Levy D. Proc. Am. Electropat. Soc. 50 (1963) 29
21. Namboodiri P.N.N., Prasad K.V., and Mathur P.B. Trans. SAEST 7 (1972) 122
22. Gabrielly G., and Raulin F. J. Appl. Electrochem. 1 (1971) 167
23. E. Lanzoni, C. Martini, R. Ruggeri, R. Bertoncello, A. Glisenti, European Federation of Corrosion Publications, 1997, p. 232.
24. Das L., and Chin D.T. Plat. Surf. Finish. 83 8 (1996) 55
25. Han K.P., and Fang J.L. Met. Finish. 95 2 (1997) 73
26. Hung A., and Chen K.-M. J. Electrochem. Soc. 136 (1989) 72
27. Cherkaoui M., Srhiri A., and Chassaing E. Plating Surf. Finish. 79 (1992) 68
28. Li J., and Kohl P.A. J. Electrochem. Soc. 150 (2003) C558
29. Cushner M.C., Melchoir W.C., and Przybylinski J.L. Mater. Perform. 29 (1990) 49
30. Younan M.M., and Abo El-Enine S.A. Galvanotechnik (2004) 2876
31. Ebn Touhami M., Chassaing E., and Cherkaoui M. Electrochim. Acta 43 (1998) 1721,21
32. Lu G., and Zangari G. J. Electrochem. Soc. 150 (2003) 777
33. Touir R., Larhzil H., Ebntouhami M., Cherrkaoui M., and Chassaing E. J. Appl. Electrochem. 36 (2006) 69
34. Saaoudi M., Ebntouhai M., Cherkaoui M., Srhiri A., Benbachir A., Elhark M., and Tangi A. Brevet Français Fr 2754831 (1998)
35. Levy D.J. Proc. Am. Electroplat. Soc. 50 (1963) 29
36. Wiese H., and Weil K.G. Ber. Bunsenges. Phys. Chem. 91 (1987) 619
37. Gafin A.H., and Orchard S.W. J. Appl. Electrochem. 22 (1992) 30
38. Lin K.-L., Chang Y.-L., Huang C.-C., Li F.-I., and Hsu J.-C. Appl. Surf. Sci. 181 1/2 (2001) 166
39. Ebn Touhami M., Cherkaoui M., Srhiri A., Benbachir A., and Chassaing E. J. Appl. Electrochem. 26 (1996) 487
40. Ohno I., Wakabayashi O., and Haruyama S. J. Electrochem. Soc. 132 (1985) 2323
41. Ohno I. Mater. Sci. Eng. A 146 (1991) 33