TPR study of electroless plated copper catalysts

Korean Journal of Chemical Engineering

Volumn 15, Issue 5, 1998, Pages 559-562

  Chang, Hsin Fu ^a   Lin, Wen Hsiung ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b Chien Kuo University   (Taiwan)

Author keywords

Alumina; Copper; Electroless Plating; TPR

Indexed keywords

EID: 0032262794     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02707110     Document Type: Article

References (14)

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