Study of the deposition of Ti/TiN multilayers by magnetron sputtering

Surface and Interface Analysis

Volumn 42, Issue 6-7, 2010, Pages 1176-1179

  Saoula, N ^a   Djerourou, S ^a   Yahiaoui, K ^a   Henda, K ^a   Kesri, R ^b   Erasmus, R M ^c   Comins, J D ^c  

^a CENTRE DE DÉVELOPPEMENT DES TECHNOLOGIES AVANCÉES   (Algeria)

^b UNIVERSITY OF SCIENCES AND TECHNOLOGY HOUARI BOUMEDIENE   (Algeria)

^c UNIVERSITY OF THE WITWATERSRAND   (South Africa)

Author keywords

EDS; Magnetron sputtering; Raman scattering; Resistivity; TiN; XRD

Indexed keywords

DEPOSITION CONDITIONS; EDS; ELECTRICAL AND STRUCTURAL PROPERTIES; FILM ORIENTATIONS; FOUR-PROBE TECHNIQUES; LOW PRESSURES; R.F. MAGNETRON SPUTTERING; REACTIVE PLASMAS; RESISTIVITY; SELF BIAS VOLTAGE; STRUCTURAL EVOLUTION; SUBSTRATE BIAS; TIN FILMS; TOTAL PRESSURE; XRD;

ARGON; CHEMICAL VAPOR DEPOSITION; ELECTRIC PROPERTIES; ENERGY DISPERSIVE SPECTROSCOPY; MAGNETRON SPUTTERING; MULTILAYERS; NITROGEN PLASMA; RAMAN SCATTERING; SCATTERING; TITANIUM NITRIDE; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

PLASMA DEPOSITION;

EID: 77954281016     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.3299     Document Type: Conference Paper

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