Rotating cylindrical magnetron sputtering: Simulation of the reactive process

Journal of Applied Physics

Volumn 107, Issue 11, 2010, Pages

  Depla, D ^a   Li, X Y ^b   Mahieu, S ^a   Van Aeken, K ^a   Leroy, W P ^a   Haemers, J ^a   De Gryse, R ^a   Bogaerts, A ^c  

^a GHENT UNIVERSITY   (Belgium)

^b TAIYUAN UNIVERSITY OF TECHNOLOGY   (China)

^c UNIVERSITY OF ANTWERP   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CYLINDRICAL MAGNETRON SPUTTERING; CYLINDRICAL TUBES; HYSTERESIS BEHAVIOR; MAGNET ASSEMBLY; PLANAR MAGNETRON; POISONING BEHAVIOR; REACTIVE GAS; REACTIVE ION; REACTIVE MAGNETRON SPUTTERING; REACTIVE PROCESS; ROTATION SPEED; SPUTTERED MATERIALS; STATIONARY MODES; TARGET ROTATION;

CHEMISORPTION; ION IMPLANTATION; TARGETS;

ROTATION;

EID: 77953634262     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3415550     Document Type: Article

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