Silver microstructure control for fluxless bonding success using Ag-In system

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 2, 2010, Pages 462-469

  Wang, Pin J ^a   Sha, Chu Hsuan ^b   Lee, Chin C ^c  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c Irvine   (United States)

Author keywords

Fluxless bonding; Indium; Silver; Silver alloys; Silver indium alloys

Indexed keywords

BINARY SYSTEMS; BONDING TEMPERATURES; COEFFICIENT OF THERMAL EXPANSION; CU SUBSTRATE; ELECTRONIC PACKAGING; FLUXLESS BONDING; GRAIN-BOUNDARY DIFFUSION; HIGH ELECTRICAL CONDUCTIVITY; HIGH TEMPERATURE; HIGH THERMAL CONDUCTIVITY; INTERMETALLIC COMPOUNDS; MELTING TEMPERATURES; MOLTEN PHASE; MOLTEN STATE; NEW DESIGN; RAPID GROWTH; SI CHIPS; SILVER MICROSTRUCTURES; SILVER-INDIUM ALLOY; SMALL GRAINS;

CHIP SCALE PACKAGES; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; INDIUM; INDIUM ALLOYS; INTERMETALLICS; MELTING POINT; METAL MELTING; MICROSTRUCTURE; ORGANIC POLYMERS; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR GROWTH; SILICON; SILICON ALLOYS; SILVER; SOLDERING ALLOYS; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMOANALYSIS;

SILVER ALLOYS;

EID: 77953477996     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2038991     Document Type: Article

References (21)

1. C. F. Coombs, Jr., Ed. "Electroplating," in Printed Circuits Handbook, 5th ed. New York: McGraw-Hill, 2001, ch. 29, pp. 29.4-29.5.
2. Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma, and K. Ishida, "Pb-free high temperature solders for power device packaging," Microelectron. Rel., vol.46, nos. 9-11, pp. 1932- 1937, Sep.-Nov. 2006.
3. X. Liu, S. Haque, J. Wang, and G.-Q. Lu, "Packaging of integrated power electronics modules using flip-chip technology," in Proc. IEEE Appl. Power Electron. Conf. Expo., vol.1. New Orleans, LA, 2000, pp. 290-296.
4. G. K. White, "Thermal expansion of reference materials: Copper, silica, and silicon," J. Phys. D: Appl. Phys., vol.6, no.17, pp. 2070-2078, Nov. 1973.
5. J. S. Kim, P. J. Wang, and C. C. Lee, "Very high temperature joints between Si and Ag-copper substrate made at low temperature using In-Ag system," IEEE Trans. Compon. Packag. Technol., vol.31, no.4, pp. 782-789, Dec. 2008.
6. J. S. Kim, P. J. Wang, and C. C. Lee, "Fluxless bonding of silicon to Ag-copper using In-Ag with two UBM designs," IEEE Trans. Compon. Packag. Technol., vol.31, no.4, pp. 776-781, Dec. 2008.
7. ASM International, "Properties of precious metals," and "Properties of pure metals," in Metals Handbook, vol.2, 10th ed. Materials Park, OH: ASM International, 1990, pp. 699 and pp. 1113.
8. B. Yeung and J.-W. Jang, "Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder," J. Mater. Sci. Lett., vol.21, no.9, pp. 723-726, May 2002.
9. G. Humpston and D. M. Jacobson, "Fluxless soldering process," Adv. Mater. Processes, vol.162, no.11, pp. 35-37, Nov. 2004.
10. C. C. Lee, D. T. Wang, and W. S. Choi, "Design and construction of a compact vacuum furnace for scientific research," Rev. Sci. Instrum., vol.77, no.12, pp. 125104-1-125104-5, Dec. 2006.
11. Y. M. Liu, Y. L. Chen, and T. H. Chuang, "Interfacial reactions between liquid indium and silver substrates," J. Electron. Mater., vol.29, no.8, pp. 1047-1051, 2000.
12. Y.-W. Yen, W.-T. Chou, Y. Tseng, C. Lee, and C.-L. Hsu, "Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders," J. Electron. Mater., vol.37, no.1, pp. 73-83, Sep. 2007.
13. D. Ma, W. D. Wang, and S. K. Lahiri, "Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow," J. Appl. Phys., vol.91, no.5, pp. 3312-3317, Mar. 2002.
14. B. Gollas, J. H. Albering, K. Schmut, V. Pointner, R. Herber, and J. Etzkorn, "Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering," Intermetallics, vol.16, no.8, pp. 962-968, Aug. 2008.
15. P. J. Wang, J. S. Kim, and C. C. Lee, "Intermetallic reaction of indium and silver in an electroplating process," J. Electron. Mater.,, vol.38, no.9, pp. 1860-1865, Jun. 2009.
16. H. Okamoto and T. B. Massalski, Eds., "Ag-In (silver-indium)," in Binary Alloy Phase Diagrams. Metal Park, OH: ASM International, 1990, pp. 47-48.
17. B. D. Cullity, "Directions of diffracted beams," in Elements of XRay Diffraction, 2nd ed. Reading, MA: Addison-Wesley, 1978, ch. 3, p. 102.
18. H.-Y. Son, G.-J. Jung, J.-K. Lee, J.-Y. Choi, and K.-W. Paik, "Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications," in Proc. IEEE Electron. Compon. Technol. Conf., Reno, NV, 2007, pp. 864-871.
19. J. Lee, J. H. Kim, and C. D. Yoo, "Thermosonic bonding of leadfree solder with metal bump for flip-chip bonding," J. Electron. Mater., vol.34, no.1, pp. 96-102, 2005.
20. M. Klein, M. Hutter, H. Oppermann, T. Fritzsch, G. Engelmann, L. Dietrich, J. Wolf, B. Bramer, R. Dudek, and H. Reichl, "Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chip," in Proc. IEEE Electron. Compon. Technol. Conf., Lake Buena Vista, 2008, p. 1893.
21. Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirari, I. Ohnuma, and K. Ishida, "Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device," Microelectron. Rel., vol.47, no.12, pp. 2147-2151, 2007.