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Volumn 31, Issue 4, 2008, Pages 782-789

Very high-temperature joints between Si and Ag-Copper substrate made at low temperature using InAg system

Author keywords

Ag; Annealing; Cu substrate; Fluxless bonding; High temperature joint; In; laminating

Indexed keywords

BRAZING; COPPER; ELECTROCHEMISTRY; INDUSTRIAL APPLICATIONS; LAMINATING; MELTING POINT; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON ALLOYS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLID SOLUTIONS; THERMAL EXPANSION; THERMAL SPRAYING; WELDING;

EID: 57349147113     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001195     Document Type: Article
Times cited : (14)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.