Effects of electroless nickel immersion gold protective finish of Cu on the reliability of the lead-free solder joint

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research

Volumn 24, Issue 2, 2010, Pages 137-143

  Zhang, Ruihong ^a   Zhao, Ran ^a   Guo, Fu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electronic packaging; ENIG; Interfacial reaction; Lead free soldering; Metallic materials

Indexed keywords

ELECTROLESS NICKEL IMMERSION GOLD; ELECTRONIC PACKAGING; INTERFACIAL INTERMETALLICS; INTERFACIAL REACTIONS; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDERING; METALLIC MATERIAL; SOLDER JOINTS; SOLDER MATRIX;

ELECTRONICS PACKAGING; GOLD; LEAD; NICKEL ALLOYS; PACKAGING MATERIALS; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 77953034031     PISSN: 10053093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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