High rate of copper electrodeposition from the hexafluorosilicate bath

Surface and Coatings Technology

Volumn 204, Issue 20, 2010, Pages 3141-3146

  Dudin, Petr V ^a,b   Reva, Olga V ^a   Vorobyova, Tatyana N ^a  

^a BELARUSIAN STATE UNIVERSITY   (Belarus)

^b UNIVERSITY OF WARWICK   (United Kingdom)

Author keywords

Copper; Electrodeposition; Hexafluorosilicate; Nucleation and growth; Plating; Thiourea

Indexed keywords

APPLIED CURRENT; COPPER ELECTRODEPOSITION; GRAIN SIZE; HEXAFLUOROSILICATE; HIGH RATE; MACROCRYSTALLINE; MASS TRANSPORT; MEAN-GRAIN SIZE; NUCLEATION AND GROWTH; PLATING RATES; SULPHATES;

ADDITIVES; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; NUCLEATION; TEXTURES; THICK FILMS; THIOUREAS; UREA;

COPPER;

EID: 77953019786     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.02.062     Document Type: Article

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