Properties of copper interconnection layers deposited by electroplating using a copper hexafluorosilicate electrolytic solution

Electrochemical and Solid-State Letters

Volumn 5, Issue 1, 2002, Pages

  Hara, Tohru ^a   Miyazawa, Kei ^a   Miyamoto, Mitsuo ^b  

^a HOSEI UNIVERSITY   (Japan)

^b Morita Chemical Incorporated   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ELECTRIC CONDUCTIVITY; ELECTROLYTES; ELECTROPLATING; STRESSES; X RAY DIFFRACTION ANALYSIS;

COPPER HEXAFLUOROSILICATE; ELECTROLYTIC SOLUTION; FULL WIDTH AT HALF-MAXIMUM; STRESS RATIO; STRESS REDUCTION; STRESS-FREE LAYER;

COPPER;

EID: 0036230330     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1419705     Document Type: Article

References (8)