Stress in copper seed layer employing in the copper interconnection

Electrochemical and Solid-State Letters

Volumn 4, Issue 10, 2001, Pages

  Hara, Tohru ^a   Sakata, Kohji ^a  

^a HOSEI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGGLOMERATION; ANNEALING; DEPOSITION; STRESSES; SURFACE ROUGHNESS; TANTALUM; TANTALUM COMPOUNDS;

BARRIER LAYERS; COPPER INTERCONNECTION; COPPER SEED LAYER;

COPPER;

EID: 0035496829     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1399876     Document Type: Article

References (8)