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Volumn , Issue , 2006, Pages 1131-1134

Integrated CMOS-based sensor array for mechanical stress mapping

Author keywords

[No Author keywords available]

Indexed keywords

ANALOG TO DIGITAL CONVERSION; CHEMICAL SENSORS; DIGITAL ARITHMETIC; DIGITAL TO ANALOG CONVERSION; ELECTRIC SIGNAL SYSTEMS; ELECTRONICS INDUSTRY; INTEGRATED CIRCUITS; NETWORKS (CIRCUITS); NONMETALS; SENSOR ARRAYS; SENSORS; SIGNAL SYSTEMS; SILICON;

EID: 50149101554     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2007.355825     Document Type: Conference Paper
Times cited : (10)

References (8)
  • 1
    • 33847328835 scopus 로고    scopus 로고
    • Novel Concept for the Multidimensional Measurement of Forces and Torques in Orthodontic Smart Brackets
    • Irvine, USA, pp
    • J. Bartholomeyczik, J. Haefner, J. Joos, F.Schubert, P. Ruther, O. Paul; "Novel Concept for the Multidimensional Measurement of Forces and Torques in Orthodontic Smart Brackets", Proc. IEEE Sensors 2005, Irvine, USA, pp. 1010-1013
    • (2005) Proc. IEEE Sensors , pp. 1010-1013
    • Bartholomeyczik, J.1    Haefner, J.2    Joos, J.3    Schubert, F.4    Ruther, P.5    Paul, O.6
  • 2
    • 0002647466 scopus 로고    scopus 로고
    • Silicon Piezoresistive Stress Sensors and Their Application in Electronic Packaging
    • J.C. Suhling R.C. Jaeger, "Silicon Piezoresistive Stress Sensors and Their Application in Electronic Packaging," IEEE Sensors J., vol. 1, no. 1, (2001), pp. 14-29.
    • (2001) IEEE Sensors J , vol.1 , Issue.1 , pp. 14-29
    • Suhling, J.C.1    Jaeger, R.C.2
  • 3
    • 84944716648 scopus 로고    scopus 로고
    • J. Schwizer, W. H. Song, M. Mayer, O. Brand, H. Baltes, Packaging Test Chip for Flip-chip and Wire Bonding Process Characterization, in Dig.Tech. Papers 12th Int, Conf. on Transducers, Solid-state Sensors, Actuators and Microsystems, Boston, MA, Jun. 2003, pp. 440-443.
    • J. Schwizer, W. H. Song, M. Mayer, O. Brand, H. Baltes, "Packaging Test Chip for Flip-chip and Wire Bonding Process Characterization," in Dig.Tech. Papers 12th Int, Conf. on Transducers, Solid-state Sensors, Actuators and Microsystems, Boston, MA, Jun. 2003, pp. 440-443.
  • 5
    • 33846516547 scopus 로고    scopus 로고
    • Design and Experimental Evaluation of a 3rd Generation Addressable CMOS Piezoresistive Stress Sensing Test Chip
    • 99, Maui, HI, USA, pp, Apr
    • J.N. Sweet, D.W. Peterson, A.H. Hsia, "Design and Experimental Evaluation of a 3rd Generation Addressable CMOS Piezoresistive Stress Sensing Test Chip," in Proc. InterPACK '99, Maui, HI, USA, pp. 1-9, Apr. 1999.
    • (1999) Proc. InterPACK , pp. 1-9
    • Sweet, J.N.1    Peterson, D.W.2    Hsia, A.H.3
  • 6
    • 33644928475 scopus 로고    scopus 로고
    • Geometry Optimization for Planar Piezoresistive Stress Sensors Based on the Pseudo-Hall Effect
    • M. Doelle, D. Mager, P. Ruther, O. Paul; Geometry Optimization for Planar Piezoresistive Stress Sensors Based on the Pseudo-Hall Effect, Sens. Actuators A127, (2006), 261-269.
    • (2006) Sens. Actuators , vol.A127 , pp. 261-269
    • Doelle, M.1    Mager, D.2    Ruther, P.3    Paul, O.4
  • 7
    • 27544506409 scopus 로고    scopus 로고
    • Multidimensional CMOS In-Plane Stress Sensor
    • J. Bartholomeyczik, S. Brugger, P. Ruther, O. Paul, " Multidimensional CMOS In-Plane Stress Sensor," IEEE Sensors J., vol. 5, no. 5, (2005), pp. 872-882.
    • (2005) IEEE Sensors J , vol.5 , Issue.5 , pp. 872-882
    • Bartholomeyczik, J.1    Brugger, S.2    Ruther, P.3    Paul, O.4
  • 8
    • 0030286542 scopus 로고    scopus 로고
    • Circuit Techniques for Reducing the Effects of Op-Amp Imperfections: Autozeroing, Correlated Double Sampling, and Chopper Stabilization
    • C.C. Enz, G.C. Temes, "Circuit Techniques for Reducing the Effects of Op-Amp Imperfections: Autozeroing, Correlated Double Sampling, and Chopper Stabilization," Proc. IEEE, vol. 84, no. 11, pp. 1584-1614, 1996.
    • (1996) Proc. IEEE , vol.84 , Issue.11 , pp. 1584-1614
    • Enz, C.C.1    Temes, G.C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.