New options for chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7607, Issue , 2010, Pages

  Schroder H ^a   Brusberg, L ^a   Arndt Staufenbiel, N ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Electrical optical circuit board; Ion exchange waveguide; Optical backplane; Optical interconnect; Out of plane coupling; Silicon photonics; System in package; Thin glass

Indexed keywords

ELECTRICAL-OPTICAL CIRCUIT BOARDS; ION-EXCHANGE WAVEGUIDES; OPTICAL BACKPLANES; OPTICAL INTERCONNECT; OUT OF PLANE COUPLING; OUT-OF PLANE; SILICON PHOTONICS; SYSTEM IN PACKAGE; THIN GLASS;

CHIP SCALE PACKAGES; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC PROPERTIES; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS PLANTS; INTEGRATED CIRCUITS; INTEGRATED OPTICS; ION EXCHANGE; ION EXCHANGERS; IONS; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; PACKAGING; PHOTONIC DEVICES; REFRACTIVE INDEX; SINGLE MODE FIBERS; SUBSTRATES; THERMODYNAMIC PROPERTIES; WAVEGUIDES;

GLASS;

CHIPS; ELECTRIC CIRCUITS; GLASS; ION EXCHANGE; PACKAGING; REFRACTIVITY; SUBSTRATES; THERMAL PROPERTIES;

EID: 77951808750     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.843818     Document Type: Conference Paper

References (28)

1. Lee, H. et al "Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer Platform" Proc. 59th Electronic Components and Technology Conf, Lake Buena Vista, FL, May (2008), pp.1093-1098.
2. Brusberg, L; Schröder, H.; Arndt-Staufenbiel, N.; Wiemer, M.; "GlassPack - a novel photonic packaging and integration technology using thin glass foils"; Proc. Photonics Europe, Strasbourg, France, 7-11 April (2008).
3. Chin, C. et al "Lab-on-a-chip devices for global health: Past studies and future opportunities". Lab Chip, No. 7 (2007), pp. 41-57. (Pubitemid 46016024)
4. Brusberg, L. et al "glassPack: A novel photonic packaging and integration technology using thin glass foils" Proc. of SPIE, Vol. 6992 (2008).
5. Brusberg, L. et al "Thin Glass Based Packaging Technologies for Optoelectronic Modules" Proc. 60th Electronic Components and Technology Conf, San Diego, CA, May (2009).
6. Miller, D.A.B.,"Physical Reasons for optical interconnects", J. Optoelectronics, Vol. 11 (1997), pp. 155-168.
7. Cartier, M.; Chan, J.; Cohen, T.; Kirk, B. "Advanced Design Techniques to Support Next Generation Backplane links Beyond 10 Gbps", Proc. of DesignCon 2007, Santa Clara, USA (2007).
8. Chen, J., "High Speed Signaling Design: from 1 Gbps to 10 Gbps", Proc. of DesignCon East 2004, Boxborough, Massachusetts, USA (2004).
9. Havermann, G.; Witte, M. "Artificial card edge interfaces for 10Gbps module cards: How the high speed propagation characteristics are affected by exchanging the PCB-edge with a connector", Proc. of DesignCon 2007, Santa Clara, USA, (2007).
10. H. Schröder; J. Bauer; F. Ebling; M. Franke; A. Beier; P. Demmer; W. Süllau; J. Kostelnik; R. Mödinger; K. Pfeiffer; U. Ostrzinski; E. Griese; Invited talk "Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards", Proc. Photonics West 2006, 21.-26.1.(2006), San Jose, USA, SPIE, pp. 6115-6136.
11. Ma, H.; Jen, A.K.-Y.; Dalton, L.R., "Polymer based optical Waveguides: Materials, Processing, and Devices", Adv. Mater., Vol. 14 (2002), No. 19, pp. 1339-1365.
12. Schröder, H., Bauer, J., Ebling, F., Franke, M., Beier, A., Demmer, P., Süllau, W., Kostelnik, J., Mödinger, M., Pfeiffer, K., Ostrzinski, U., Griese, E.; Invited talk "Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards"; Proc. Photonics West 2006, San Jose, USA, 21-26 January (2006).
13. S. Uhlig, L. Fröhlich, M. Chen, N. Arndt-Staufenbiel, G. Lang, H. Schröder, R. Houbertz, M. Popall, M. Robertsson, "Polymer Optical Interconnects - A Scalable Large-Area Panel Processing Approach", IEEE Transactions on Advanced Packaging, Vol. 29, No.1, pp. 158-170, Feb.(2006).
14. Liu, Y.; Lin, L.; Choi, C.C.; Bihari, B.; Chen, R.T, "Polymer based board-level optoelectronic interconnects via micro-mirror coupler", Proc. SPIE, Vol. 4292 (2001), pp. 141-149.
15. Shibata, T,; Matsuoka, Y.; Ban, T., "A high-coupling-efficiency multilayer optical printed wiring board with a cube-core structure for high-density optical interconnection", Proc. of 57th ECTC, Reno, USA, May 27. - June 1, (2007), pp. 1275-1289. (Pubitemid 47577192)
16. Dellmann, L.; Berger, C.; Beyeler, R.; Dangel, R.; Gmür, M; Hamelin, R.; Horst, R.; Lamprecht, T.; Meier, N.; Morf, T.; Oggioni, S.; Sprefico, M.; Stevens, R.; Offrein, B.J., "120 Gb/s optical card-to-card Interconnect Link demonstrator with embedded waveguides", Proc. of 57th ECTC, Reno, USA, May 27. - June 1, (2007), pp. 1288-1293. (Pubitemid 47577194)
17. Schröder, H., Arndt-Staufenbiel, N., Beier, A., Ebling, F., Franke, M., Griese, E., Intemann, S., Kostelnik, J., Kühler, T., Mödinger, R., Roda, I., Schlosser, I.; "Thin Glass Based Electrical-Optical Circuit Boards (EOCB) Using Ion-Exchange Technology for Graded-Index Multimode Waveguides"; Proc. 58st ECTC, Lake Buena Vista, Florida, USA, 27-30 May (2008), pp. 268-1257
18. Taira, Y.; Numata, H.; Yamada, F.; Nakagawa, S.; Hasegawa, M.; Terada, K.; Tsukada, Y. "OE Device Integration for optically Enabled MCM", Proc. of 57th ECTC, Reno, USA, May 27. - June 1, (2007), pp. 1262-1267. (Pubitemid 47577190)
19. www.itrs.net
20. Schröder, H. "Optical coupling using thin glass based arrayed waveguide components" Proc. of 14th Microoptics Conference, Brussels, 25-27 September (2008), pp. 56-57.
21. Schröder, H. et al "Out-of-plane coupling using thin glass based arrayed waveguide components" Proc. of SPIE, Vol. 7221 (2009).
22. Joshi, R. "Chip on glass - interconnect for row/column driver packaging" Microelectronics Journal No.29 (1998), pp. 343-349.
23. Najafi, S. I., "Introduction to Glass-Integrated Optics", Artech House Boston, London, (1992).
24. Ramaswamy, R. V. "Planar buried ion-exchanged glass waveguides: difffusion characteristics" Journal of Quantum Electronics, Vol. QE-22, No. 6 (1986), pp.883-892.
25. Ramaswamy, R. V. et al "Ion-exchanged glass waveguides: a review" Journal of Lightwave Technology, Vol. 6, No. 6 (1988), pp. 984-1004.
26. Arndt-Staufenbiel et al "Specific glass fiber technologies: lensing and laser fusion," Proc. of SPIE, Vol. 5445 (2004).
27. Zimmermann, L., Tekin, T., Schröder, H., Dumon, P., Bogaerts, W., "How to bring nanophotonics to application - silicon photonics packaging", IEEE LEOS NEWSLETTER, December (2008), S. 4-14.
28. Tekin, T., Schröder, H., Zimmermann, L., Dumon, P., Bogaerts, W.; "Fibre-Array Optical Interconnection for Silicon Photonics"; Proc. of ECOC, Brussels, 21-25 September (2008), pp. 93-94.