OE device integration for optically enabled MCM

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1262-1267

  Taira, Yoichi ^a   Numata, Hidetoshi ^a   Yamada, Fumiaki ^a   Katayama, Yasunao ^a   Nakagawa, Shigeru ^a   Hasegawa, Masaki ^a   Terada, Kenji ^b   Tsukada, Yutaka ^b  

^a IBM RESEARCH TOKYO   (Japan)

^b KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATION; MULTICARRIER MODULATION; OPTICAL DEVICES; OPTICAL SIGNAL PROCESSING; SURFACE EMITTING LASERS;

HIGHER OPTICAL SPEED; INTERFACE CHIPS; OPTICAL CONNECTORS; OPTICAL DEVICE INTEGRATION; SLC CARRIER;

INTEGRATED OPTOELECTRONICS;

EID: 35348842637     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373957     Document Type: Conference Paper

References (6)

1. J. A. Kash, et al.: "Terabus: a chip-to-chip parallel optical interconnect" Lasers and Electro-Optics Society, 2005. LEOS 2005. The 18th Annual Meeting of the IEEE, Oct. 2005, pp. 363 - 364.
2. J.A Kash,. et al.:, "Chip-to-chip optical interconnects," Optical Fiber Communication Conference, 2006 and the 2006 National Fiber Optic Engineers Conference, March 2006.
3. N. Suzuki, H. Hatakeyama, K. Fukatsu, T.Anan, K. Yashiki, and M. Tsuji: "25-Gbps operation of 1.1-μm-range InGaAs VCSELs for high-speed optical interconnections," OFC Conference 2006, March 2006; also refer to the press release on the dense high-speed optical module by NEC Corp. (Sep. 15, 2006) http://www.nec.co.jp/press/ja/0609/1501.html; http://www.nec.co.jp/press/ja/ 0609/1501-01.hrml.
4. B.J. Offrein, et al.: "High bandwidth board-level parallel optical interconnects for server applications" ECOC06, September 2006.
5. T. Matsubara: "Three Dimensional Optical Interconnect on Organic Circuit Board," Proceedings of 2006 Electronic Components and Technology Conference, pp. 790-794.
6. th Int'l Mini-Symposium on Advanced Organic Photonics, Oct 20, 2006.