"glassPack": A novel photonic packaging and integration technology using thin glass foils

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6992, Issue , 2008, Pages

  Brusberg, Lars ^a   Schröder, Henning ^a   Arndt Staufenbiel, Norbert ^a   Wiemer, Maik ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

D263T ; Fiber fusion; Foturan ; Fusion bonding; Ion exchange; Optical sensing; Sensor packaging; Thin glass foils

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER NETWORKS; DATA FUSION; DETECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; ETCHING; FIBER OPTIC SENSORS; FLUIDIC DEVICES; FUSION REACTIONS; GLASS; HEALTH; INTEGRATED OPTICS; INTEGRATED OPTOELECTRONICS; INTEGRATION; ION EXCHANGE; LASERS; MICROSYSTEMS; NANOSTRUCTURED MATERIALS; NUCLEAR PHYSICS; OPTICAL GLASS; OPTICAL INTERCONNECTS; OPTICAL MATERIALS; OPTICAL PROPERTIES; OPTICAL SYSTEMS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; PACKAGING; PLATING; PULSED LASER DEPOSITION; REFRACTIVE INDEX; SEMICONDUCTING CADMIUM TELLURIDE; SENSOR DATA FUSION; SENSORS; TECHNOLOGY; TECHNOLOGY TRANSFER; WAVEGUIDES; WIRE;

(PL) PROPERTIES; ELECTRICAL WIRES; ELECTRONIC SYSTEMS (ES); FLUIDIC CHANNELS; HIGH SPEEDS; HIGH THERMAL; INDEX TUNING; INT EGRATED MICROSYSTEMS; INTEGRATED WAVEGUIDES; INTEGRATION TECHNOLOGIES; ION-EXCHANGE; MICRO FLUIDIC CHANNELS; MICRO SYSTEMS; MICRO-OPTICS; MULTI-MODE APPLICATIONS; ON-WAFER; OPTICAL (PET) (OPET); OPTICAL ELEMENTS; OPTICAL INTERCONNECTION; OPTOELECTRONIC COMPONENTS; OPTOELECTRONIC SYSTEMS; PHOTONIC PACKAGING; SENSOR MODULES; SUBSTRATE MATERIALS; WIDE AREA;

GLASS BONDING;

EID: 45149129661     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.780867     Document Type: Conference Paper

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