Is 3D integration an opportunity or just a hype?

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn , Issue , 2010, Pages 541-543

  Li, Jin Fu ^a,b   Wu, Cheng Wen ^b,c  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3-D INTEGRATION; CHIP SOLUTIONS; EMERGING TECHNOLOGIES; HETEROGENEOUS INTEGRATION; INTEGRATED CIRCUIT DESIGNS; INTERCONNECT PERFORMANCE; SMALL FORM FACTORS; TECHNOLOGICAL CHALLENGES; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH-SILICON-VIA; VOLUME PRODUCTION;

APPROXIMATION THEORY; COMPUTER AIDED DESIGN; DIGITAL INTEGRATED CIRCUITS; INTEGRATED CIRCUITS;

THREE DIMENSIONAL;

EID: 77951239673     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2010.5419826     Document Type: Conference Paper

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