Mechanical reliability modeling and characterization for package-on-package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1445-1452

  Amagai, Masazumi ^a   Suzuki, Yutaka ^a   Abe, Kenji ^a   Kim, YoungBae ^a   Sano, Hitoyuki ^a  

^a Texas Instruments Japan Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; COMPUTER NETWORKS; DELAMINATION; ERROR ANALYSIS; FINITE ELEMENT METHOD; MATERIALS SCIENCE; OPTIMIZATION; POLLUTION; RELIABILITY; STEEL SHEET; THERMOELECTRIC EQUIPMENT;

ELECTRONIC COMPONENTS; MECHANICAL RELIABILITY; WARPAGE;

STRESSES;

EID: 51349137191     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550167     Document Type: Conference Paper

References (6)

1. Yutaka Suzuki,et al "Design Optimization Techniques for Package Warpage", Proceedings of the International Conference on Electronic Packaging, April 18-20th, 2007
2. Youngbae Kim ,et al "Assessment of Inter-Level Dielectric Strength in Actual Package", Proceedings of the International Conference on Electronic Packaging, April 18-20th, 2007.
3. Kenji Abe, et al, "Resin Spacer material characterization for Stacked Die Package", The 8th VLSI Packaging Workshop in Japan, Dec. 4-5, 2006
4. Masazumi Amagai, Yoshitaka Toyoda and Takeshi Tashima, " High Solder Joint Reliability with Lead Free Solders", Proceedings of the IEEE 53 rd Electronic Components and Technology Conference, 2003, pp317-322.
5. Masazumi Amagai, Yoshitaka Toyoda, Tsukasa Ohnishi, Satoru Akita, " High Drop Test Reliability: Lead-free Solders", Proceedings of the IEEE 54 th Electronic Components and Technology Conference, USA, 2004, pp 1304-1309.
6. Masazumi Amagai, " A Study of Nano Particles in SnAg based lead free solders", Proceedings of the IEEE 56th Electronic Components and Technology Conference, USA, 2006, ppl 170-1190.