Time- and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 539-548

  Ernst, L J ^a   Zhang, G Q ^b   Jansen, K M B ^a   Bressers, H J L ^c  

^a FACULTY OF INDUSTRIAL DESIGN ENGINEERING   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; POISSON RATIO; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

PACKAGING MOLDING COMPOUND; PACKAGING PROCESS STRESS; THERMOMECHANICAL MODELING;

ELECTRONICS PACKAGING;

EID: 0347567452     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604156     Document Type: Article

References (11)

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