Advanced viscoelastic material model for predicting warpage of a QFN panel

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1635-1640

  De Vreugd, J ^a   Jansen, K M B ^a   Xiao, A ^a   Ernst, L J ^a   Bohm, C ^b   Kessler, A ^b   Preu, H ^b   Stecher, M ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; COMPUTER NETWORKS; COOLING; FORECASTING; MECHANICAL PROPERTIES; MOLDING; SHEET MOLDING COMPOUNDS; SILICON; SILICON COMPOUNDS; VISCOELASTICITY;

WARPAGE;

FINITE ELEMENT METHOD;

EID: 51349131110     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550196     Document Type: Conference Paper

References (7)

1. Yang, D.G. et al, "Numerical modeling of warpage induced in QFN array molding process", Microelectronics Reliability Vol. 47 (2007), pp. 310-318.
2. van Driel, W.D. et al, "Prediction and verification of process induced warpage of electronic packages", Microelectronics Reliability, Vol.43 (2003), pp. 165-114.
3. Narasimalu Srikanth, "Warpage analysis of epoxy packages using viscoelastic based model" J. Mater. Sc., Vol. 41 (2006), pp. 3773 - 3780.
4. st Electronics Systemintegration Techn. Conf, Dresden, Germany, September 2006, pp. 782-787.
5. th Int. Conf. on thermal, mechanical and multi-phsics simulations and experiments in micro-electronics and micro-systems. Freiburg, Germany, April 2008.
6. Rzepka, S et al, "The effect of visco-elasticity on the result accuracy of FEM panel warpage simulations supporting industrial microelectronics packaging", Proc. 8 Int. Conf. on thermal, mechanical and multi-phsics simulations and experiments in micro-electronics and micro-systems. London, England, April 2007, pp 336-343.
7. ABAQUS (2007) ABAQUS/Standard User's manual, Version 6.7-1.