Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications

Thermochimica Acta

Volumn 439, Issue 1-2, 2005, Pages 127-134

  He, Yi ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Dynamic mechanical analysis (DMA); No flow underfill; Relaxation modulus; Shift factor; Time temperature superposition (TTS); Viscoelasticity

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; FUNCTIONS; MATHEMATICAL MODELS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

NO-FLOW UNDERFILL MATERIALS; RELAXATION MODULES; SHIFT FACTOR; TIME-TEMPERATURE SUPERPOSITION (TTS);

FLIP CHIP DEVICES;

EID: 28044473448     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2005.09.016     Document Type: Article

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