Underfill fracture toughness as a function of cooling rate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 913-917

  Park, Soojae ^a   Feger, Claudius ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

UNDERFILL;

COMPUTER NETWORKS; COOLING; FREEZING; STRENGTH OF MATERIALS; STRESSES; THERMAL STRESS; THERMOELASTICITY;

FRACTURE TOUGHNESS;

EID: 51349116634     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550085     Document Type: Conference Paper

References (9)

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9. E 399-90, "Standard Test Method for Plane-Strain Fracture Toughness fo Metallic Materials." American Society for Testing and Materials, Philadelphia, 1990