Hot carrier luminescence for backside 0.15 μm CMOS device analysis

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 116-119

  Ng, W ^a   Gao, G ^a   Abraham, A ^b   Lundquist, T ^b  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^b NPTest Inc ^*  (United States)

Author keywords

Backside analysis; Hot carriers; Light emission; PICA

Indexed keywords

CMOS INTEGRATED CIRCUITS; SILICON DETECTORS; SPICE;

BACKSIDE ANALYSE; CARRIER DETECTION; CMOS DEVICES; DETECTION RATES; DEVICE ANALYSIS; HOT CARRIER LUMINESCENCE; HOT-CARRIERS; MICRO CHANNEL PLATE; PICA; SILICON AVALANCHE-PHOTODIODE;

HOT CARRIERS;

EID: 77951013671     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194246     Document Type: Conference Paper

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