Substrate-embedded millimeter wave SiGe VCO chip

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 605-608

  Richter, Marius D ^a   Schneider, Martin ^a  

^a UNIVERSITY OF BREMEN   (Germany)

Author keywords

Integrated circuit packaging; MMIC oscillators; Printed circuit layout; Tunable oscillators

Indexed keywords

HIGH FREQUENCY; INTEGRATED CIRCUIT PACKAGING; MICROVIAS; MMIC OSCILLATOR; OUTPUT POWER; PRINTED CIRCUIT LAYOUT; TUNABLE OSCILLATOR; TUNING RANGES; VOLTAGE CONTROLLED OSCILLATOR; WIRE BONDS;

CHIP SCALE PACKAGES; ELECTRIC FUSES; INSULATING MATERIALS; INTEGRATED CIRCUITS; MICROWAVE CIRCUITS; MICROWAVE INTEGRATED CIRCUITS; MICROWAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PRINTED CIRCUIT MANUFACTURE; SILICON ALLOYS; VARIABLE FREQUENCY OSCILLATORS;

PRINTED CIRCUIT BOARDS;

EID: 77949950444     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165769     Document Type: Conference Paper

References (8)

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