-
1
-
-
1542696248
-
Thermal and Electrical Anisotropy of Polycrystalline Silicon
-
Bean K. E., Hentzschei H. P., and Colman D., "Thermal and Electrical Anisotropy of Polycrystalline Silicon", J. Appl. Phys., vol. 40, pp.2358-2359, 1969.
-
(1969)
J. Appl. Phys.
, vol.40
, pp. 2358-2359
-
-
Bean, K.E.1
Hentzschei, H.P.2
Colman, D.3
-
4
-
-
0010360218
-
Thermal Variation Apparatus for X-ray Diffraction Experiments up to 3000K
-
Fug G, Gasparoux H and Piaud J J, "Thermal Variation Apparatus for X-ray Diffraction Experiments up to 3000K," J. Phys., E: Sci. Instrum. 5, pp. 1222.
-
J. Phys., E: Sci. Instrum.
, vol.5
, pp. 1222
-
-
Fug, G.1
Gasparoux, H.2
Piaud, J.J.3
-
6
-
-
0027005375
-
A Microstructure for Measurement of Thermal Conductivity of Polysilicon Thin Films
-
Friedemann Volklein and Henry Baltes, "A Microstructure for Measurement of Thermal Conductivity of Polysilicon Thin Films", J. Microelectromechanical Systems, Vol.1, No.4, pp. 193-196, 1992.
-
(1992)
J. Microelectromechanical Systems
, vol.1
, Issue.4
, pp. 193-196
-
-
Volklein, F.1
Baltes, H.2
-
7
-
-
84975549760
-
A new interferometer capable of measure of measuring small optical path differences
-
Kinzly R.E., 1967, "A new interferometer capable of measure of measuring small optical path differences," Appl. Opt. 6, pp. 137-140, 1972.Lin L., and Chiao M., "Electrothermal Responses of Line Shape Microstructures", Sensors and Actuators, A55, pp.31-41, 1996.
-
(1967)
Appl. Opt.
, vol.6
, pp. 137-140
-
-
Kinzly, R.E.1
-
8
-
-
0030182958
-
Electrothermal Responses of Line Shape Microstructures
-
Kinzly R.E., 1967, "A new interferometer capable of measure of measuring small optical path differences," Appl. Opt. 6, pp. 137-140, 1972.Lin L., and Chiao M., "Electrothermal Responses of Line Shape Microstructures", Sensors and Actuators, A55, pp.31-41, 1996.
-
(1996)
Sensors and Actuators
, vol.A55
, pp. 31-41
-
-
Lin, L.1
Chiao, M.2
-
9
-
-
0007766215
-
Improved thermoelectric infared sensor using double poly CMOS technology
-
Yokohama, Japan, June 7-10
-
th Int. Conf. Solid-State Sensors and Actuators (Transducers' 93), Yokohama, Japan, June 7-10, 1993, pp. 1008-1011.
-
(1993)
th Int. Conf. Solid-State Sensors and Actuators (Transducers' 93)
, pp. 1008-1011
-
-
Lenggenhager, R.1
Baltes, H.2
-
10
-
-
0028408991
-
Determination of thermophysical properties of CMOS IC Polysilicon
-
Paul O. M., Korvink J. G., and Baltes H., "Determination of thermophysical properties of CMOS IC Polysilicon", Sensors and Actuators, A41-42, pp.161-164, 1994.
-
(1994)
Sensors and Actuators
, vol.A41-42
, pp. 161-164
-
-
Paul, O.M.1
Korvink, J.G.2
Baltes, H.3
-
11
-
-
0027668512
-
Thremal Conductivity of CMOS Materials for the Optimization of Microsensors
-
Paul O. M., and Baltes H., "Thremal Conductivity of CMOS Materials for the Optimization of Microsensors", J. Micromech. Microeng. 3, pp.110-112, 1993.
-
(1993)
J. Micromech. Microeng.
, vol.3
, pp. 110-112
-
-
Paul, O.M.1
Baltes, H.2
-
13
-
-
0033148946
-
A Microstructure for in-situ Determination of Residual Strain
-
June
-
Pan C. S. and Hsu W., "A Microstructure for in-situ Determination of Residual Strain", IEEE/ASME J. Microelectromechanical Systems, Vol. 8, No. 2, June, 1999, pp.200.
-
(1999)
IEEE/ASME J. Microelectromechanical Systems
, vol.8
, Issue.2
, pp. 200
-
-
Pan, C.S.1
Hsu, W.2
-
14
-
-
1542801547
-
A Simple Method for in situ Determination of Linear Thermal Expansion Coefficients of Thin Films
-
will appear, November 5-10, Orlando, Florida, USA
-
Pan C. S., "A Simple Method for in situ Determination of Linear Thermal Expansion Coefficients of Thin Films", will appear to The Symposium on Instrumentation. Measurements, and Sensors at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida, USA
-
(2000)
The Symposium on Instrumentation. Measurements, and Sensors at the 2000 ASME International Mechanical Engineering Congress and Exposition
-
-
Pan, C.S.1
-
15
-
-
1542801545
-
A Simple Microstructure Serves as a Material Characterization Structure
-
will appear, Oct. 19-21, in the Jockey Club, Hong Kong
-
Pan C. S., "A Simple Microstructure Serves as a Material Characterization Structure", will appear to the Internal Symposium on Smart structures and Microsystems, Oct. 19-21, 2000, in the Jockey Club, Hong Kong.
-
(2000)
Internal Symposium on Smart Structures and Microsystems
-
-
Pan, C.S.1
-
16
-
-
36749106419
-
Elastic stiffness and thermal expansion coefficient of BN films
-
Retajczyk T. F Jr., A. K. Sinha, "Elastic stiffness and thermal expansion coefficient of BN films," Appl. Phys. Lett. 36, pp.161-163, 1980.
-
(1980)
Appl. Phys. Lett.
, vol.36
, pp. 161-163
-
-
Retajczyk Jr., T.F.1
Sinha, A.K.2
-
17
-
-
18244390620
-
Thermal Conductivity of Heavily Doped Low-Pressure Chemical Vapor Deposited Polycrystalline Silicon Films
-
1
-
Tai Y. C., Mastrangelo C. H., and Muller R. S., "Thermal Conductivity of Heavily Doped Low-Pressure Chemical Vapor Deposited Polycrystalline Silicon Films", J. Appl. Phys. 63(5), 1, pp.1441-1447, 1988.
-
(1988)
J. Appl. Phys.
, vol.63
, Issue.5
, pp. 1441-1447
-
-
Tai, Y.C.1
Mastrangelo, C.H.2
Muller, R.S.3
|