Fabricating metallic wire grating inside a polymeric substrate by insertion nanoimprint

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 872-875

  Chen, Chia Meng ^a   Sung, Cheng Kuo ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Insertion nanoimprint; Metallic wire grating; PMMA; Polarizer

Indexed keywords

AFM; DEMOLDING; FLEXIBLE POLYMERIC SUBSTRATES; FLEXIBLE SUBSTRATE; INNOVATIVE PROCESS; METALLIC STRUCTURES; METALLIC WIRE; MOLD-FILLING; NANO-IMPRINT; NANOIMPRINT PROCESS; PACKAGING PROCESS; POLYMERIC SUBSTRATE; PRESSURE CONDITIONS; VARIOUS SUBSTRATES;

NANOSTRUCTURES; OPTICAL INSTRUMENTS; SEALING (CLOSING); SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; WIRE;

CHIP SCALE PACKAGES;

EID: 76949106787     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.12.047     Document Type: Article

References (9)

1. Chou S.Y., Krauss P.R., and Renstrom P.J. Appl. Phys. Lett. 67 (1995) 3114-3116
2. Yu Z., Deshpande P., Wu W., Wang J., and Chou S.Y. Appl. Phys. Lett. 77 (2000) 927-929
3. Lohstroh W., Felcher G.P., Goyette R., Munzenberg M., and Felsch W. Physica B-Condensed Matter 267 (1999) 352-354
4. Ahn S.W., Lee K.D., Kim J.S., Kim S.H., Park J.D., Lee S.H., and Yoon P.W. Nanotechnology 16 (2005) 1874-1877
5. Ahn S.W., Lee K.D., Kim J.S., Kim S.H., Lee S.H., Park J.D., and Yoon P.W. Microelectronic Engineering 78 (2005) 314-318
6. Hsieh C.W., Hsiung H.Y., Lu Y.T., Sung C.K., Wang W.H., and Phys J. D: Appl. Phys. 40 (2007) 3440-3447
7. Cheng M.C., Hsiung H.Y., Lu Y.T., and Sung C.K. Jpn. J. Appl. Phys. 46 (2007) 6382-6386
8. Peng C., and Cardozo B.L. J. Vac. Sci. Technol. B. 26 2 (2008) 632-635
9. Huang X.D., Bao L.R., Cheng X., Guo L.J., Peng S.W., and Yee A.F. J. Vac. Sci. Technol. B. 20 6 (2002) 2872-2876