Local/global planarization of polysilicon micropatterns by selectivity controlled CMP

International Journal of Precision Engineering and Manufacturing

Volumn 10, Issue 3, 2009, Pages 31-36

  Shin, Woonki ^a   Park, Sungmin ^b   Kim, Hyoungjae ^c   Joo, Sukbae ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c Korea Institute of Industrial Technology   (South Korea)

Author keywords

Chemical mechanical polishing(CMP); Dishing; MEMS; Polysilicon; Selectivity

Indexed keywords

EID: 76849117161     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-009-0044-x     Document Type: Article

References (15)

1. Jeong, H., Ohmori, H., Doy, T. and Nakagawa, T., "Integrated Planarization Technique with Consistency in Abrasive Machining for Advanced Semiconductor Chip Fabrication," Annals of the CIRP, Vol. 45, No. 1, pp. 311-314, 1996.
2. Nagayama, K., Sakai T., Kimura K. and Tanaka K., "Numerical Analysis of a Slurry Flow on a Rotating CMP Pad Using a Twophase Flow Model," IJPEM, Vol. 9, No. 2, pp. 8-10, 2008
3. Pavan, P., Bez, R., Olivo, P. and Zanoni, E., "Flash Memory Cell-an Overview," Proc. IEEE, Vol. 85, No. 8, pp. 1248-1271, 1997.
4. Lee, W. M., Katoh, T., Kang, H. G., Paik, U., Jeon, H. and Park, J. G., "Effects of Abrasive Size and Surfactant in Nano Ceria Slurry for Shallow Trench Isolation," J of Korean Phys. Soc., Vol. 44, No. 4, pp. L796-L799, 2004
5. Sniegowski, J, J., "Chemical Mechanical Polishing: Enhancing the Manufacturability of MEMS," Proc. SPIE, Vol. 2879, pp. 104-115, 1996.
6. Miyashita, N., Uekusa, S. I., Kodera, M., Matsui, Y. and Katsumata, H., "Development of Dishing-less Slurry for Polysilicon Chemical-Mechanical Polishing Process," Jpn. J. Appl. Phys., Vol. 42, No. 9A, pp. 5433-5437, 2003
7. Simon, J. and Vladimir, A., "Control of Polysilicon Topography in a High Selectivity Chemical Mechanical Polishing Process," J. Electrochem. Soc., Vol. 146, No. 3, pp. 1158-1162, 1999
8. Kim, H. Y, Kim, H. J. and Jeong, H. D., "Development of an Abrasive Embedded Pad for Dishing Reduction and Uniformity Enhancement," J. of KPS, Vol. 37, No. 6, pp. 945-951, 2000.
9. Jeong, H. D., Kim, H. J., Lee, S. H. and Dornfeld, D., "Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues," Annals of the CIRP, Vol. 55, No. 1, pp. 325-328, 2006
10. Kim, H. J., Kim, H. Y., Jeong, H. D., Lee, E. S. and Shin, Y. J., "Friction and Thermal Phenomena in Chemical Mechanical Polishing," J. of MPT, Vol. 130-131, pp. 334-338, 2002.
11. Sato, K., Shikida, M., Matsushima, Y., Yamashiro, T., Asaumi, K., Iriye, Y. and Yamamoto, M., "Characterization of Orientation-Dependent Etching Properties of Single-Crystal Silicon: Effects of KOH Concentration," Sensors and Actuators A, Vol. 64, No. 1, pp. 87-93, 1998.
12. Sato, K., Shikida, M., Matsushima, Y., Yamashiro, T., Asaumi, K., Iriye, Y. and Yamamoto, M., "Anisotropic Etching Rates of Single-Crystal Silicon for TMAH Water Solution as a Function of Crystallographic Orientation," Sensors and Actuators A, Vol. 73, No. 1, pp. 131-137, 1999.
13. Ahmadi, G. and Xun, X., "A Model for Mechanical Wear and Abrasive Particle Adhesion during the CMP Process," J. Electrochem. Soc., Vol. 148, No. 3, pp. G99-G109, 2001
14. Yasseen, A. A., Mourlas, N. J. and Mehregany, M., "Chemical-Mechanical Polishing for Polysilicon Surface Micromachining," J. Electrochem. Soc., Vol. 144, No. 1, pp. 237-242, 1997.
15. Smekalin, K. and Fertig, D., "Microscale Dishing Effect in a Chemical Mechanical Planarization Process for Trench Isolation," J. Electrochem. Soc., Vol. 143, No. 12, pp. 1281-1283, 1996