Microscale dishing effect in a chemical mechanical planarization process for trench isolation

Journal of the Electrochemical Society

Volumn 143, Issue 12, 1996, Pages

  Smekalin, K ^a   Fertig, D ^a,b  

^a VTC Inc   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; HYDRODYNAMICS; HYDROXYLATION; INTEGRATED CIRCUIT MANUFACTURE; NITRIDES; OXIDES; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; THIN FILMS;

CHEMICAL MECHANICAL POLISHING (CMP); DISHING; FIELD OXIDES; ISOLATION TRENCHES; PLANARIZATION PROCESS;

CHEMICAL POLISHING;

EID: 0030413232     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837296     Document Type: Article

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