Control of reactive high power impulse magnetron sputtering processes

Surface and Coatings Technology

Volumn 204, Issue 14, 2010, Pages 2159-2164

  Audronis, M ^a   Bellido Gonzalez, V ^a   Daniel, B ^a  

^a Gencoa Ltd   (United Kingdom)

Author keywords

High power impulse magnetron sputtering; HIPIMS; Process control; Reactive sputtering

Indexed keywords

COATING DEPOSITION; COATING STRUCTURES; CONTROL METHODS; DC MAGNETRON SPUTTERING; DEPOSITION PROCESS; HIGH POWER IMPULSE MAGNETRON SPUTTERING; HIGH-POWER; HIPIMS; LONG TERM STABILITY; MAGNETRON SPUTTERING PROCESS; MEDIUM FREQUENCIES; METAL TARGET; OXYGEN PARTIAL PRESSURE; PERMEATION BARRIERS; PHYSICAL VAPOUR DEPOSITION; PLASMA EMISSION MONITORING; POTENTIAL BENEFITS; PRECISE CONTROL; REACTIVE DEPOSITION; REACTIVE GAS; SEMICONDUCTOR APPLICATIONS; SPUTTERED SPECIES; STABLE OPERATION; STRUCTURE PROPERTY RELATIONSHIPS; THIN FILM MATERIAL; TRANSPARENT CONDUCTIVE OXIDES;

COATINGS; CONDUCTIVE FILMS; DEPOSITION; GAS PERMEABLE MEMBRANES; HYSTERESIS; MAGNETRON SPUTTERING; MAGNETRONS; OXYGEN; THIN FILMS;

PROCESS CONTROL;

EID: 76549125610     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.11.040     Document Type: Article

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