Conception of a consumable copper reaction zone for a NiTi/SnAgCu composite material

Composites Part A: Applied Science and Manufacturing

Volumn 33, Issue 10, 2002, Pages 1391-1395

  Fouassier, Olivier ^a   Chazelas, Jean ^b   Silvain, Jean François ^a  

^a CNRS   (France)

^b THALES   (France)

Author keywords

Electroless copper coating; Interfacial study; Lead free solder; Metal matrix composite; Nickel titanium (NiTi); Shape memory alloy

Indexed keywords

ACTIVATION ENERGY; AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION; INTERFACES (MATERIALS); INTERMETALLICS; NICKEL ALLOYS; SHAPE MEMORY EFFECT; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

LEAD-FREE SOLDERS;

COMPOSITE MATERIALS;

EID: 0036816231     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(02)00154-9     Document Type: Conference Paper

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