|
Volumn 6, Issue SUPPL. 2, 2009, Pages
|
Influence of thermal anneal steps on the current collapse of fluorine treated enhancement mode SiN/AlGaN/GaN HEMTs
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CARRIER DENSITY;
CIRCUIT DESIGNS;
CURRENT COLLAPSE;
DEEP LEVEL TRAP;
DEPLETION MODES;
ENHANCEMENT MODES;
FLUORINE IONS;
HIGH ELECTRON MOBILITY;
HIGH FREQUENCY;
NEGATIVE BIAS;
NEGATIVE VALUES;
ON CURRENTS;
OPERATION MODE;
POSITIVE VALUE;
POWER CONSUMPTION;
THERMAL ANNEALS;
ELECTRIC CURRENT MEASUREMENT;
ELECTRON MOBILITY;
FLUORINE;
GALLIUM ALLOYS;
GALLIUM NITRIDE;
THRESHOLD VOLTAGE;
HIGH ELECTRON MOBILITY TRANSISTORS;
|
EID: 75749108477
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.200880838 Document Type: Article |
Times cited : (32)
|
References (7)
|