Damage-free design of megasonic waveguide for single wafer process

ECS Transactions

Volumn 25, Issue 5, 2009, Pages 303-309

  Ahn, Y K ^a   Yoo, D H ^a   Yang, J C ^a,b   Kulkarni, A ^a   Kim, J I ^c   Lee, H M ^c   Kim, T ^a,d  

^a Sungkyunkwan University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c DURASONIC Co   (South Korea)

^d Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC FIELDS; CHEMICAL CLEANING; ENERGY TRANSFER; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; WAVEGUIDES;

ACOUSTIC CAVITATIONS; CHEMICAL SOLUTIONS; COMPARATIVE STUDIES; CONTAMINATED SURFACES; MEGASONIC CLEANING; SEMICONDUCTOR INDUSTRY; SINGLE WAFER PROCESS; STRUCTURAL DAMAGES;

SILICON WAFERS;

EID: 75249086450     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3202667     Document Type: Conference Paper

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