Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time

Journal of the Electrochemical Society

Volumn 153, Issue 9, 2006, Pages

  Bakhtari, Kaveh ^a   Guldiken, Rasim O ^a   Makaram, Prashanth ^a   Busnaina, Ahmed A ^a,c   Park, Jin Guo ^b,c  

^a NORTHEASTERN UNIVERSITY   (United States)

^b Hanyang University   (South Korea)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POLYSTYRENE LATEX (PSL) PARTICLES; SEMICONDUCTOR MANUFACTURING; SILICON-CAP FILMS;

ACOUSTIC STREAMING; MULTILAYERS; POLYSTYRENES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON; THIN FILMS;

NANOSTRUCTURED MATERIALS;

EID: 33750114737     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2217287     Document Type: Article

References (30)

1. The International Technology Roadmap for Semiconductors (ITRS), SIA (2004).
2. J. Olaf, Acustica, 7, 253 (1957).
3. D. H. McQuecn, Ultrasonics, 24, 273 (1986).
4. I. Kashkoush, A. A. Busnaina, F. W. Kern, and R. F. Kunesh, Ultrasonic Cleaning of Surfaces - An Overview, Particles on Surfaces, Vol. 3, K. Mittal, Editor, pp. 217-237, Plenum, New York (1991).
5. G. W. Gale and A. A. Busnaina. Part. Sci. Technol., 17, 229 (1999).
6. A. A. Busnaina, I. I. Kashkoush, and G. W. Gale, J. Electrochem. Soc., 142, 2812 (1995).
7. A. A. Busnaina and G. W. Gale, Part. Sci. Technol., 17, 229 (1999).
8. A. A. Busnaina and G. W. Gale, Part. Sci. Technol., 15, 229 (1997).
9. M. Olim. J. Electrochem. Soc., 144, 3657 (1997).
10. J. M. Bernard, O. Guildkin, A. A. Busnaina, and J. Park, Semiconductor Fabtech, 23rd ed., pp. 77-79 (2004).
11. H. Lin, Ph.D. Thesis, Clarkson University, Potsdam, NY (2001).
12. W. L. Nyhorg, Acoustic Streaming, Physical Acoustics, Vol II-Part B, W. P. Mason, Editor, Academic Press, New York (1965).
13. K. Bakhtari, O. Guldiken, P. Makaram, A. A. Busnaina, and J. Park, in The Adhesion Society, Proceedings, 2005, p 404-406 (2005).
14. D. S. Rimai and D. J. Quesnel, Fundamentals of Particle Adhesion, Global Press (2001).
15. R. A. Bowling, Particles and Surfaces Detection, Adhesion and Removal, pp. 129-142, Plenum Press, New York (1988).
16. V. M. Muller, B. V. Derjaguin, and Y. P. Toporov, Colloids Surf., 7, 251 (1983).
17. K. L. Johnson, K. Kendall, and A. D. Roberts. Proc. R. Soc. London, Ser. A, 324, 301 (1971).
18. S. Krishnan, A. A. Busnaina, D. S. Rimai, and D. P. DeMejo, J. Adhes. Sci. Technol., 8, 1357 (1994).
19. R. Hogg, T. W. Healy, and D. W. Fuerstenau, Trans. Faraday Soc., 62, 1638 (1966).
20. J. Gregory, J. Chem. Soc., Faraday Trans. 2, 69, 1723 (1973).
21. J. Gregory, J. Colloid Interface Sci., 51, 44 (1975).
22. K. Bakhtari, R. Guldiken, A. A. Busnaina, and J. Park, The Adhesion Society, Proceedings, 2005, p. 115-117 (2005).
23. K. Bakhtari, O. Guldiken, A. A. Busnaina, and J. Park, J. Electrochem. Soc., 153, C603 (2006).
24. O. Guldiken, K. Bakhtari, A. A. Busnaina, and J. Park, Solid State Phenom., 103-104, 137 (2005).
25. M. Soltani and G. Ahmadi, J. Adhes. Sci. Technol., 8, 763 (1994).
26. F. Zhang, A. A. Busnaina, and G. Ahmadi, J. Electrochem. Soc., 146, 2665 (1999).
27. S. Lee, Y. Hong, J. Song, J. Park, A. A. Busnaina, G. Zhang, F. Eschbach, and A. Ramamoorthy, Jpn. J. Appl. Phys., Part 1, 44, 5560 (2005).
28. A. A. Busnaina, in Proceedings, SEMICON Korea, Seoul, Korea, Jan 21-23, pp. 147-162 (2003).
29. J'. M. Bernard, O. Guildkin, A. A. Busnaina, and J. Park, Semiconductor Fabtech, 23rd ed., pp. 77-79 (2004).
30. A. A. Busnaina, J. Park, A. Ramamoorthy, and G. Zhang. Proceedings, 2nd International EUVL Symposium (CD), Antwerp, Belgium (2003).