SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 87, Issue 4, 2010, Pages 610-613

Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process

(4) Han, Kang Soo a Hong, Sung Hoon a Jeong, Jun Ho b Lee, Heon a

a Korea University (South Korea)

b Korea Institute of Machine and Materials (South Korea)

Author keywords

NIL(nano imprint lithography); PVA(poly vinyl alcohol); Residual thickness; RIL(reversal imprint lithography)

Indexed keywords

3D STRUCTURES; ANTI-STICTION; ANTI-STICTION LAYERS; BONDING AGENT; IMPRINT LITHOGRAPHY; PATTERNED MOLDS; POLYMERIC RESIN; RESIDUAL THICKNESS; SI SUBSTRATES; SILICON SUBSTRATES; SUBMICRON; THIN LAYERS; UV CURABLE; UV-LIGHT;

CURING; MOLDS; NANOSTRUCTURES; OXIDE MINERALS; QUARTZ; RESINS; STICTION; THREE DIMENSIONAL; TWO DIMENSIONAL;

NANOIMPRINT LITHOGRAPHY;

EID: 75149178562 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2009.08.022 Document Type: Article

Times cited : (5)

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