Ultrashort laser subsurface micromachining of threedimensional microfluidic structures inside photosensitive glass

Laser and Particle Beams

Volumn 27, Issue 3, 2009, Pages 521-528

  Wang, Z ^a   Zheng, H ^a   Zhou, W ^a,b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Microfluidic structures; Photosensitive glass; Subsurface micromachining; Ultrashort laser

Indexed keywords

CHEMICAL ETCHING; CRYSTALLIZED STRUCTURE; DEVICE FABRICATIONS; DILUTED HYDROFLUORIC ACIDS; DIRECT WRITING; ETCHED SURFACE; FEMTOSECOND LASER IRRADIATION; FOTURAN GLASS; LASER DIRECT WRITING; LATENT IMAGES; MICRO-COMPONENTS; MICROFLUIDIC COMPONENTS; MICROFLUIDIC STRUCTURES; MICROOPTICAL; MULTIPLE CHANNELS; SINGLE CHIPS; THERMAL ANNEALING PROCESS; THERMAL-ANNEALING; THREE-DIMENSIONAL MICROFLUIDICS; ULTRASHORT LASER;

COMPOSITE MICROMECHANICS; FLUIDIC DEVICES; GLASS BONDING; GLASS LASERS; HYDROFLUORIC ACID; LASER BEAM EFFECTS; LIGHT SENSITIVE MATERIALS; MICROFLUIDICS; MICROMACHINING; PHOTORESISTS; PHOTOSENSITIVITY; PULSED LASER APPLICATIONS; THREE DIMENSIONAL;

PHOTOSENSITIVE GLASS;

EID: 74149088050     PISSN: 02630346     EISSN: 1469803X     Source Type: Journal    
DOI: 10.1017/S0263034609990255     Document Type: Article

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