Flexible MEMS technology and its first application to shear stress sensor skin

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1997, Pages 465-470

  Jiang, Fukang ^a   Tai, Yu Chong ^a   Walsh, Ken ^a   Tsao, Tom ^a   Lee, Gwo Bin ^a   Ho, Chih Ming ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; POLYIMIDES; REACTIVE ION ETCHING; SHEAR STRESS; THICK FILMS; THIN FILMS;

SHEAR STRESS SENSOR SKIN;

MICROELECTROMECHANICAL DEVICES;

EID: 0030645994     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)